? semiconductor components industries, llc, 2016 december, 2016 ? rev. 16 1 publication order number: mc74vhc1g01/d mc74vhc1g01 single 2-input nand gate with open drain output the mc74vhc1g01 is an advanced high speed cmos 2?input nand gate with an open drain output fabricated with silicon gate cmos technology. the internal circuit is composed of multiple stages, including an open drain output which provides the ability to set output switching level. this allows the mc74vhc1g01 to be used to interface 5 v circuits to circuits of any voltage between v cc and 7 v using an external resistor and power supply. the mc74vhc1g01 input structure provides protection when voltages up to 7 v are applied, regardless of the supply voltage. features ? high speed: t pd = 3.7 ns (typ) at v cc = 5 v ? low internal power dissipation: i cc = 1 a (max) at t a = 25 c ? power down protection provided on inputs ? pin and function compatible with other standard logic families ? chip complexity: fets = 62 ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant 5 1 2 4 3 v cc in b in a out y gnd in a in b out y & ovt figure 1. pinout (top view) figure 2. logic symbol www. onsemi.com marking diagrams see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information v0 = device code m = date code* = pb?free package sc?88a / sot?353 / sc?70 df suffix case 419a tsop?5 / sot?23 / sc?59 dt suffix case 483 v0 m l l h h l h l h function table inputs output ab z z z l y pin assignment 1 2 3 gnd in b in a 4 5v cc out y (note: microdot may be in either location) 1 5 v0 m m *date code orientation and/or position may vary depending upon manufacturing location.
mc74vhc1g01 www. onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage 0.5 to 7.0 v v in dc input voltage ?0.5 to +7.0 v v out dc output voltage 0.5 to v cc 0.5 v i ik dc input diode current ?20 ma i ok dc output diode current v out gnd; v out v cc 20 ma i out dc output sink current, per pin 25 ma i cc dc supply current, v cc and gnd pin 25 ma t stg storage temperature range 65 to 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance sc70?5/sc?88a (note 1) tsop?5 350 230 c/w p d power dissipation in still air at 85 c sc70?5/sc?88a tsop?5 150 200 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v?0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) 2000 200 n/a v i latchup latchup performance above v cc and below gnd at 125 c (note 5) 500 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 2?ounce copper trace with no air flow. 2. tested to eia/jesd22?a114?a. 3. tested to eia/jesd22?a115?a. 4. tested to jesd22?c101?a. 5. tested to eia/jesd78. recommended operating conditions symbol characteristics min max unit v cc dc supply voltage 2.0 5.5 v v in dc input voltage 0.0 5.5 v v out dc output voltage 0.0 7.0 v t a operating temperature range ?55 +125 c t r , t f input rise and fall time v cc = 3.3 v 0.3 v v cc = 5.0 v 0.5 v 0 0 100 20 ns/v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. device junction temperature versus time to 0.1% bond failures junction temperature c time, hours time, years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 failure rate of plastic = ceramic until intermetallics occur figure 3. failure rate vs. time junction temperature normalized failure rate time, years t j = 130 c t j = 120 c t j = 110 c t j = 100 c t j = 90 c t j = 80 c
mc74vhc1g01 www. onsemi.com 3 dc electrical characteristics v cc t a = 25 c t a 85 c 55 c t a 125 c symbol parameter test conditions (v) min typ max min max min max unit v ih minimum high?level input voltage 2.0 3.0 4.5 5.5 1.5 2.1 3.15 3.85 1.5 2.1 3.15 3.85 1.5 2.1 3.15 3.85 v v il maximum low?level input voltage 2.0 3.0 4.5 5.5 0.5 0.9 1.35 1.65 0.5 0.9 1.35 1.65 0.5 0.9 1.35 1.65 v v ol maximum low?level output voltage v in = v ih or v il v in = v ih or v il i ol = 50 a 2.0 3.0 4.5 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih or v il i ol = 4 ma i ol = 8 ma 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 i lkg z?state output leakage current v in = v il v out = v cc or gnd 5.5 5 10 10 a i in maximum input leakage current v in = 5.5 v or gnd 0 to 5.5 0.1 1.0 1.0 a i cc maximum quiescent supply current v in = v cc or gnd 5.5 1.0 20 40 a i off power off?output leakage current v out = 5.5 v v in = 5.5 v 0 0.25 2.5 5 a product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. ac electrical characteristics input t r = t f = 3.0 ns symbol parameter test conditions t a = 25 c t a 85 c ?55 t a 125 c unit min typ max min max min max t pzl maximum output enable time, input a or b to y v cc = 3.3 0.3 vc l = 15 pf r l = r i = 500 c l = 50 pf 5.5 8.0 7.9 11.4 9.5 13.0 11.0 15.5 ns v cc = 5.0 0.5 vc l = 15 pf r l = r i = 500 c l = 50 pf 3.7 5.2 5.5 7.5 6.5 8.5 8.0 10.0 t plz maximum output disable time v cc = 3.3 0.3 v c l = 50 pf r l = r i = 500 8.0 11.4 13.0 15.5 ns v cc = 5.0 0.5 v c l = 50 pf r l = r i = 500 5.2 7.5 8.5 10.0 c in maximum input capacitance 4 10 10 10 pf c pd power dissipation capacitance (note 6) typical @ 25 c, v cc = 5.0v pf 18 6. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no?load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
mc74vhc1g01 www. onsemi.com 4 50% 50% v cc t pzl t plz v ol +0.3 v v cc gnd high impedan c y a or b r l v cc ? 7 v ovt v cc a b figure 4. output voltage mismatch application pulse generator r t dut v cc r l r 1 c l v cc x 2 c l = 50 pf equivalent (includes jig and probe capacitance) r l = r 1 = 500 or equivalent r t = z out of pulse generator (typically 50 ) figure 5. switching waveforms figure 6. test circuit e = (a ? b ) + (c+d ) v cc a b c d mc74vhc1g01 mc74vhc1g03 2.2 k 1 2 3 5 4 v cc r led v cc a b 3.3 v 1.5 v gtl 220 mc74vhc1g01 a b figure 7. complex boolean functions figure 8. led driver figure 9. gtl driver ordering information device package shipping ? MC74VHC1G01DFT1G sc?88a / sc70?5 / sot?353 (pb?free) 3000 units / tape & reel nlv74vhc1g01dft1g* mc74vhc1g01dft2g mc74vhc1g01dtt1g tsop?5 / sot23?5 / sc59?5 (pb?free) 3000 units / tape & reel nlv74vhc1g01dtt1g* ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable.
mc74vhc1g01 www. onsemi.com 5 package dimensions sc?88a case 419a?02 issue l notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419a?01 obsolete. new standard 419a?02. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. dim a min max min max millimeters 1.80 2.20 0.071 0.087 inches b 1.15 1.35 0.045 0.053 c 0.80 1.10 0.031 0.043 d 0.10 0.30 0.004 0.012 g 0.65 bsc 0.026 bsc h --- 0.10 --- 0.004 j 0.10 0.25 0.004 0.010 k 0.10 0.30 0.004 0.012 n 0.20 ref 0.008 ref s 2.00 2.20 0.079 0.087 b 0.2 (0.008) mm 12 3 4 5 a g s d 5 pl h c n j k ?b? mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 solder footprint
mc74vhc1g01 www. onsemi.com 6 package dimensions tsop?5 case 483?02 issue m 0.7 0.028 1.0 0.039 mm inches scale 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions a and b do not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 per side. dimension a. 5. optional construction: an additional trimmed lead is allowed in this location. trimmed lead not to extend more than 0.2 from body. dim min max millimeters a b c 0.90 1.10 d 0.25 0.50 g 0.95 bsc h 0.01 0.10 j 0.10 0.26 k 0.20 0.60 m 0 10 s 2.50 3.00 123 54 s a g b d h c j 0.20 5x c ab t 0.10 2x 2x t 0.20 note 5 c seating plane 0.05 k m detail z detail z top view side view a b end view 1.35 1.65 2.85 3.15 on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mc74vhc1g01/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
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